The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Oct. 28, 2003
William C. Weigler, New Braunfels, TX (US);
Robert Babula, New Braunfels, TX (US);
James E. Herbold, Gonzales, TX (US);
Thomas P. Gall, Northbrook, IL (US);
Steven G. Sharkey, Island Park, IL (US);
William C. Weigler, New Braunfels, TX (US);
Robert Babula, New Braunfels, TX (US);
James E. Herbold, Gonzales, TX (US);
Thomas P. Gall, Northbrook, IL (US);
Steven G. Sharkey, Island Park, IL (US);
Temic Automotive of North America, Inc., Deer Park, IL (US);
Abstract
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.