Richmond, VT, United States of America

James C Weaver

This inventor holds 1 USPTO granted patent. Top assignee: Utmc Microelectronic Systems Inc.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James C Weaver. Retrieved from https://idiyas.com/inventor/james-c-weaver-hk1wfup1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: James C Weaver - Innovator in Integrated Circuit Metallization

Introduction

James C Weaver is a notable inventor based in Richmond, Vermont, who has made significant contributions to the field of integrated circuits. With a focus on metallization techniques, Weaver's work has implications for the efficiency and performance of electronic devices.

Latest Patents

Weaver holds a patent for a Multi-level interconnect metallization technique. This innovative method involves forming metallization layers and vias as part of an interconnect structure within an integrated circuit (IC). The metallization layers and vias are created from an alloy that includes tungsten and other materials such as aluminum, gold, copper, cobalt, titanium, molybdenum, or platinum. Alternatively, the alloy may consist of aluminum without tungsten. The deposition of these alloy layers onto the IC substrate is achieved using ionized cluster beam (ICB) apparatus. The IC substrate is an 'in-process' IC, which means that various active devices, including bipolar and/or MOS transistors, resistors, and capacitors, are formed in the substrate using conventional techniques prior to the ICB deposition. Intermediate processing steps, such as patterning and etching to form the vias, may occur between ICB deposition steps.

Career Highlights

Weaver is associated with Utmc Microelectronic Systems Inc., where he applies his expertise in integrated circuit technology. His work has been instrumental in advancing the capabilities of microelectronic systems.

Collaborations

Weaver collaborates with Rick C Jerome, contributing to the innovative environment at Utmc Microelectronic Systems Inc. Their partnership enhances the development of cutting-edge technologies in the field.

Conclusion

James C Weaver's contributions to integrated circuit metallization techniques exemplify the importance of innovation in the electronics industry. His patent and work at Utmc Microelectronic Systems Inc. highlight his role as a key figure in advancing microelectronic technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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