Saginaw, MI, United States of America

James C Mundell


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018-2025

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3 patents (USPTO):Explore Patents

Title: Innovations of James C Mundell

Introduction

James C Mundell is an accomplished inventor based in Saginaw, MI (US). He holds a total of 3 patents that reflect his expertise in the field of polysilicon technology. His innovative approaches have contributed significantly to advancements in the semiconductor industry.

Latest Patents

One of his latest patents is titled "Method and apparatus for removal of surface carbon from polysilicon." This invention describes a method for removing surface carbon contamination from polycrystalline silicon. The process involves subjecting the silicon to a high-velocity fluid, resulting in a product stream with surface carbon levels reduced to less than 200 parts per billion by weight. Another notable patent is the "Polysilicon chip reclamation assembly and method of reclaiming polysilicon chips from a polysilicon cleaning apparatus." This invention includes a cleaning apparatus designed to manage polysilicon chips generated during the cleaning process, ensuring efficient routing and fluid injection to facilitate chip movement.

Career Highlights

Throughout his career, James C Mundell has worked with notable companies such as Hemlock Semiconductor Operations LLC and Hemlock Semiconductor Corporation. His contributions to these organizations have been instrumental in enhancing their technological capabilities and product offerings.

Collaborations

James has collaborated with several professionals in his field, including James J Mueller and Brian S Cichowski. These partnerships have fostered innovation and development in polysilicon technologies.

Conclusion

James C Mundell's work exemplifies the spirit of innovation in the semiconductor industry. His patents and career achievements highlight his significant contributions to technology and the advancement of polysilicon applications.

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