James C Burnham

Title: The Innovative Contributions of James C. Burnham

Introduction: James C. Burnham, a talented inventor based in Kalispell, Montana, has made significant strides in the field of electroplating. With a strong focus on improving manufacturing processes, his patent showcases innovative methods that could revolutionize the industry.

Latest Patents: James holds a patent for "Electroplating seed layer buildup and repair." This invention details exemplary methods of electroplating that involve delivering a current from a power supply through a plating bath within an electroplating chamber. Notably, the current delivery may include a pulsed current with a duty cycle of around 50%. His methodology emphasizes the precision of plating a metal substrate, which defines a via, followed by transitioning the power supply to continuous DC current delivery for enhanced performance.

Career Highlights: Throughout his career, James has been affiliated with Applied Materials, Inc., a leading company in providing manufacturing solutions for the semiconductor, display, and solar industries. His engagement in this dynamic environment has allowed him to contribute significantly to innovative practices in electroplating.

Collaborations: Collaboration is vital in any innovative endeavor, and James C. Burnham has worked alongside renowned colleagues like Marvin L. Bernt and Robert Douglas Mikkola. Together, they combine their expertise to explore and develop groundbreaking technologies.

Conclusion: James C. Burnham exemplifies the spirit of innovation through his contributions to electroplating technology. His patent not only showcases his inventiveness but also highlights the collaborative efforts in the pursuit of advanced manufacturing solutions. With his work, James continues to inspire the next generation of inventors and innovators in the field.