The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Oct. 23, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Marvin L. Bernt, Whitefish, MT (US);

James C. Burnham, Kalispell, MT (US);

Robert Mikkola, Kalispell, MT (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/18 (2006.01); C25D 7/12 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 5/18 (2013.01); C25D 7/123 (2013.01); H01L 21/2885 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01);
Abstract

Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty cycle of less than or about 50%. The methods may include plating a first amount of metal on a substrate within the plating bath. The substrate may define a via within the substrate. The methods may include, subsequent the first period of time, transitioning the power supply to a continuous DC current delivery for a second period of time. The methods may include plating a second amount of metal on the substrate.


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