Chandler, AZ, United States of America

James B Zaccardi

This inventor holds 1 USPTO granted patent. Top assignee: Viasat, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James B Zaccardi. Retrieved from https://idiyas.com/inventor/james-b-zaccardi-bump4rte

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: James B. Zaccardi: Antenna and RF Technology Inventor

Introduction

James B. Zaccardi is an inventor based in Chandler, Arizona, whose patent work concerns antenna design and radio-frequency integrated circuit (RFIC) packaging. He is associated with Viasat, Inc. His listed portfolio includes 1 patent.

Latest Patents

Zaccardi’s patent, “Method of Forming Antenna with Underfill,” describes a process for integrating an antenna element with an RFIC component. The method forms the antenna element on the upper surface of an antenna substrate and creates an opening through the substrate. An RFIC component is attached to the lower surface using interconnects, with beamforming circuitry configured to couple to the antenna element through the substrate. Underfill is introduced through the opening and flows into the space between the interconnects.

Career Highlights

The patent reflects Zaccardi’s work on antenna structures and component integration. Its approach uses an opening in the substrate to deliver underfill around the interconnects while maintaining the RFIC’s connection to the antenna element.

Collaborations

Zaccardi is associated with Viasat, Inc., a company working in communications technology. The available information identifies the company connection but does not specify additional collaborators on the patent.

Conclusion

James B. Zaccardi’s patent documents a method for integrating an antenna substrate, beamforming circuitry, and underfill, highlighting his contribution to antenna and RFIC packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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