Eagle, ID, United States of America

Jagdish Prasad

This inventor holds 1 USPTO granted patent. Top assignee: Ami Semiconductor, Inc.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jagdish Prasad. Retrieved from https://idiyas.com/inventor/jagdish-prasad-a372d3dy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Jagdish Prasad: Innovator in Metal Interconnect Protection

Introduction

Jagdish Prasad is a notable inventor based in Eagle, Idaho, recognized for his contributions to the field of semiconductor technology. He has developed innovative methods that enhance the reliability and performance of metal interconnects in electronic devices. His work is particularly significant in the context of modern microelectronics, where precision and durability are paramount.

Latest Patents

Jagdish Prasad holds a patent titled "Methods for sidewall protection of metal interconnect for unlanded vias using physical vapor deposition." This patent describes a process for protecting the sidewall of a metal interconnect component through Physical Vapor Deposition (PVD) techniques. The method involves depositing a single barrier metal on the sidewall of the metal interconnect after its formation. An anisotropic etching process is then employed to remove the barrier metal from the horizontal surface, leaving a portion on the top surface. Following this, a dielectric layer is formed over the metal interconnect and the barrier metal. The unlanded via is etched through the dielectric layer to the metal interconnect, which is subsequently filled with a second metal to establish electrical connections with upper metal layers.

Career Highlights

Jagdish Prasad is currently associated with Ami Semiconductor, Inc., where he applies his expertise in semiconductor manufacturing and innovation. His work has contributed to advancements in the reliability of electronic components, making significant impacts in the industry.

Collaborations

Throughout his career, Jagdish has collaborated with several professionals, including Mark Michael Nelson and Brett N Williams. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jagdish Prasad's contributions to the field of semiconductor technology, particularly through his patented methods for metal interconnect protection, highlight his role as a key innovator. His work not only enhances the performance of electronic devices but also sets a foundation for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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