Seoul, South Korea

Jaesung Bae

This inventor holds 1 USPTO granted patent. Top assignee: Korea Aerospace University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaesung Bae. Retrieved from https://idiyas.com/inventor/jaesung-bae-s06dud5j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Jaesung Bae in Aerial Vehicle Technology.

Introduction

Jaesung Bae is an innovative inventor based in Seoul, South Korea. He has made significant contributions to the field of aerospace engineering, particularly in the development of transformable wing technology. His work is aimed at enhancing the capabilities of aerial vehicles.

Latest Patents

Jaesung Bae holds a patent for a "Transformable wing and aerial vehicle including same." This patent describes a transformable wing that consists of a main wing with multiple ribs extending in both the forward and backward directions. The design includes a span morphing part with an auxiliary wing and a scissors part that allows for dynamic adjustments in the wing's configuration.

Career Highlights

Jaesung Bae is affiliated with Korea Aerospace University, where he engages in research and development in aerospace technologies. His work has garnered attention for its innovative approach to improving aerial vehicle performance.

Collaborations

Jaesung Bae collaborates with notable colleagues, including Jaebaek Jeong and Hyunchul Lee. Their combined expertise contributes to advancements in the field of aerospace engineering.

Conclusion

Jaesung Bae's contributions to transformable wing technology represent a significant advancement in aerial vehicle design. His innovative approach and collaboration with fellow researchers continue to push the boundaries of aerospace engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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