Company Filing History:
1 out of 740 
1 out of 48 Years Active: 2025
Title: Jaemyoung Son: Innovator in Multi-Layer Polyethylene Film Technology
Introduction
Jaemyoung Son is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of materials science, particularly in the development of advanced polyethylene films. His innovative work has led to the creation of a multi-layer structure that enhances the performance of packaging materials.
Latest Patents
Jaemyoung Son holds a patent for a polyethylene film having a multi-layer structure. This film includes an outer layer (A) made from a first ethylene polymer with a density ranging from 0.935 to 0.968. The intermediate layer (B) consists of a second ethylene polymer with a density between 0.900 and 0.920. The inner layer (C) is composed of a third ethylene polymer with a density of 0.850 to 0.905. The layers are sequentially laminated to form a polyethylene film that exhibits impressive mechanical properties, including a falling ball impact strength per unit thickness of 3.0 to 15.0 g/μm and a puncture strength per unit thickness of 0.2 to 0.4 N/μm. Additionally, there is a significant difference in melting point between the outer layer (A) and the inner layer (C), which ranges from 30 to 100° C.
Career Highlights
Throughout his career, Jaemyoung Son has worked with prominent companies in the industry. He has been associated with SK Innovation Co., Ltd. and SK Geo Centric Co., Ltd., where he has contributed to various projects and advancements in polymer technology. His expertise in the field has made him a valuable asset to these organizations.
Collaborations
Jaemyoung Son has collaborated with talented individuals such as Eunjung Baek and Soyoung Park. These collaborations have fostered innovation and have led to the successful development of new materials and technologies.
Conclusion
Jaemyoung Son is a distinguished inventor whose work in multi-layer polyethylene film technology has made a significant impact in the field of materials science. His innovative patent and collaborations highlight his commitment to advancing packaging solutions.