Daejeon, South Korea

Jae Wook Baek

This inventor holds 1 USPTO granted patent. Top assignee: Jeongyang Sg Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Wook Baek. Retrieved from https://idiyas.com/inventor/jae-wook-baek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jae Wook Baek: Advancing Heat-Insulating UHPC

Introduction

Jae Wook Baek is an inventor based in Daejeon, South Korea. His patent work includes a high-performance concrete composition designed to combine improved heat insulation with compressive strength. Baek is associated with Jeongyang Sg Co., Ltd.

Latest Patents

Baek is credited with 1 patent: “Heat Insulation UHPC Composition Having Enhanced Heat Insulation Properties and Compressive Strength.” The invention incorporates silica beads into ultra-high-performance concrete (UHPC) to help block radiant heat while enhancing the material’s insulating properties and compressive strength.

A preferred formulation specifies, per 100 parts by weight of cement, 24–26 parts silica fume, 20–60 parts fine aggregate, 30–150 parts silica beads, and 3–4 parts superplasticizer. The cement is mixed with water at a water-to-cement ratio of 28 percent.

Career Highlights

Baek’s disclosed invention focuses on improving the thermal performance of UHPC without sacrificing strength. Its proposed use of silica beads offers a material-design approach to addressing both insulation and structural performance.

Collaborations

The patent information names Byung Kwun Ahn and Young Jong Yoo as Baek’s coworkers. Their inclusion reflects the collaborative context associated with the invention.

Conclusion

Jae Wook Baek’s patent presents a UHPC composition intended to pair enhanced heat insulation with compressive strength, highlighting his contribution to materials innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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