Uiwang-si, South Korea

Jae Won Heo



Average Co-Inventor Count = 6.6

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2016-2019

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10 patents (USPTO):Explore Patents

Title: Jae Won Heo: Innovator in Thermoplastic Resin Technology

Introduction

Jae Won Heo is a prominent inventor based in Uiwang-si, South Korea. He has made significant contributions to the field of thermoplastic resin technology, holding a total of 10 patents. His innovative work focuses on enhancing the properties of copolymers and thermoplastic resin compositions.

Latest Patents

Among his latest patents, Jae Won Heo has developed a copolymer that includes an aromatic vinyl-based monomer, an unsaturated nitrile-based monomer, a cross-linkable siloxane compound, and an N-substituted maleimide-based monomer. This copolymer aims to achieve a synergistic effect of matting characteristics and heat resistance properties. Additionally, he has created a thermoplastic resin composition that features a rubber-modified vinyl-based graft copolymer, a silicone-modified aromatic vinyl-based copolymer, and an aromatic vinyl-unsaturated nitrile-based copolymer. This composition is designed to exhibit low-gloss characteristics while providing a synergistic effect of impact resistance and heat resistance.

Career Highlights

Jae Won Heo has worked with notable companies such as Lotte Advanced Materials Co., Ltd. and Samsung SDI Co., Inc. His experience in these organizations has allowed him to refine his expertise in materials science and polymer engineering.

Collaborations

He has collaborated with talented individuals in his field, including Bo Eun Kim and Joo Hyun Jang. These partnerships have contributed to the advancement of his research and innovations.

Conclusion

Jae Won Heo's contributions to thermoplastic resin technology and his impressive portfolio of patents highlight his role as a leading inventor in the industry. His work continues to influence advancements in material properties and applications.

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