This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Lam Research Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Jae Shin - Innovator in Electroplating Solutions
Introduction
Jae Shin is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of electroplating, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of electroplating systems.
Latest Patents
Jae Shin's latest patents include innovative systems and methods for electroplating. One of his patents addresses byproduct removal from electroplating solutions. This electroplating system is designed to contain an anode and an electroplating solution, featuring a wafer holder to support a wafer within the electroplating cell. The system also includes a reservoir for the electroplating solution and a recirculation flowpath that connects the reservoir and the electroplating cell. This flowpath is equipped with a pump to circulate the solution and a frother that generates bubbles in the solution when activated. Another patent focuses on enhancing the TSV process window and fill performance through long pulsing and ramping. This method initiates a bulk electrofill phase with a high current pulse, followed by a reduction to a baseline current level, and optionally increases the current in steps until the electroplating is complete.
Career Highlights
Jae Shin is currently employed at Lam Research Corporation, where he continues to develop innovative solutions in the electroplating domain. His expertise and inventions have contributed to advancements in the manufacturing processes of electronic devices.
Collaborations
Jae Shin has collaborated with notable coworkers, including Joseph Richardson and Jeyavel Velmurugan. Their combined efforts have fostered a creative environment that encourages innovation and problem-solving in their projects.
Conclusion
Jae Shin's contributions to electroplating technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in electroplating systems, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile