The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jan. 08, 2021
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Jae Shin, Beaverton, OR (US);
Joseph Richardson, Sherwood, OR (US);
Jeyavel Velmurugan, Portland, OR (US);
Thomas Anand Ponnuswamy, Sherwood, OR (US);
Steven T. Mayer, Aurora, OR (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/18 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 17/08 (2006.01); C25D 21/12 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C25D 5/18 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/08 (2013.01); C25D 21/12 (2013.01); H01L 21/76898 (2013.01);
Abstract
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.