Company Filing History:
Years Active: 2011
Title: Jae-Shik Shin: Pioneering Innovations in Substrate Bonding Technologies
Introduction
Jae-Shik Shin is a notable inventor hailing from Hwaseong-si, South Korea. His contributions to the field of substrate bonding highlight his commitment to advancing technology in electronics. With a singular focus on innovation, Jae-Shik has developed methodologies that are crucial for the evolution of packaging in electronic devices.
Latest Patents
Jae-Shik Shin holds one patent, which covers a substrate level bonding method and a substrate level package. The patent discloses a novel process that involves multiple unit substrate sections, separated by holes, and a base substrate that faces these unit sections. This innovative design incorporates substrate adhesion sections formed from DFR material, with specified portions remaining uncured, enhancing the bonding mechanism between the unit substrate sections and the base substrate.
Career Highlights
Currently, Jae-Shik is a key member of Samsung Electronics Co., Ltd., where he continues to drive innovation in electronic packaging technologies. His work is pivotal in enhancing the functionality and reliability of electronic devices in today’s market. His strong technical expertise and innovative mindset have earned him recognition within the industry.
Collaborations
Throughout his career, Jae-Shik Shin has collaborated with esteemed colleagues, including Chul-soo Kim and Kuk-jin Chun. Together, this team of innovators strives to push the boundaries of what is possible in electronics, focusing on improving the efficiency and effectiveness of electronic packaging solutions.
Conclusion
Jae-Shik Shin's dedication to innovation in substrate bonding methods is evident through his patent and ongoing work at Samsung Electronics. His contributions not only reflect his personal ingenuity but also serve as a building block for future advancements in the technology sector. As the industry evolves, inventors like Jae-Shik will continue to play a critical role in shaping the future of electronics.