The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Dec. 23, 2009
Chul-soo Kim, Hwaseong-si, KR;
Kuk-jin Chun, Seoul, KR;
Sung-chan Kang, Seoul, KR;
Jong-hyuk Kim, Andong-si, KR;
In-sang Song, Yongin-si, KR;
Duck-hwan Kim, Goyang-si, KR;
Jae-shik Shin, Hwaseong-si, KR;
Chul-Soo Kim, Hwaseong-si, KR;
Kuk-Jin Chun, Seoul, KR;
Sung-Chan Kang, Seoul, KR;
Jong-Hyuk Kim, Andong-si, KR;
In-Sang Song, Yongin-si, KR;
Duck-Hwan Kim, Goyang-si, KR;
Jae-Shik Shin, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.