Seoul, South Korea

Jae Ok Kim

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignees: Korea Advanced Institute of Science and Technology, Micropack Co., Ltd., Optopac Co., Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Ok Kim. Retrieved from https://idiyas.com/inventor/jae-ok-kim-jmk2f488

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Jae Ok Kim: Innovator in Functional Fibers

Introduction

Jae Ok Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of functional fibers, particularly in the development of innovative materials that enhance the bonding of electronic components.

Latest Patents

Jae Ok Kim holds a patent for a functional fiber and fiber aggregate, which includes an adhesive designed for easy bonding of electronic components. The patent, titled "Fiber, fiber aggregate and adhesive having the same," describes a fiber that extends in a length direction and consists of a carrier polymer embedded with a plurality of functional particles. These particles are physically fixed to the carrier polymer, allowing for various functionalities.

Career Highlights

Throughout his career, Jae Ok Kim has worked with prominent organizations such as Optopac Co., Ltd. and the Korea Advanced Institute of Science and Technology. His work in these institutions has allowed him to explore and develop advanced materials that have practical applications in technology.

Collaborations

Some of Jae Ok Kim's notable coworkers include Deok Hoon Kim and Kyung Wook Paik. Their collaborative efforts have contributed to the advancement of research in functional materials.

Conclusion

Jae Ok Kim's innovative work in functional fibers and adhesives showcases his commitment to advancing technology in the field of materials science. His contributions are paving the way for new applications in electronic components and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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