Anyang, South Korea

Jae Hwan Chung

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Amorepacific Corporation. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Hwan Chung. Retrieved from https://idiyas.com/inventor/jae-hwan-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Jae Hwan Chung

Introduction: Jae Hwan Chung is a visionary inventor hailing from Anyang-si, South Korea. With a passion for creating groundbreaking solutions, he has made significant contributions to the field of technology through his inventive spirit and dedication.

Latest Patents: Jae Hwan Chung holds several patents in the realm of electronics and telecommunications, showcasing his expertise in developing cutting-edge technologies that push the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Jae Hwan Chung has worked with leading tech companies to bring his inventions to life. His innovative ideas have not only revolutionized the industry but have also earned him recognition as a pioneer in his field.

Collaborations: Jae Hwan Chung has collaborated with top researchers and engineers to further enhance his inventions and bring them to the market. His ability to work effectively in a team setting has led to the successful implementation of his groundbreaking ideas.

Conclusion: In conclusion, Jae Hwan Chung stands as a shining example of a forward-thinking inventor who continues to shape the future of technology with his remarkable innovations. His passion for creating transformative solutions underscores his commitment to driving progress and making a lasting impact on the world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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