Dublin, CA, United States of America

Jae Ho Lee

USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations of Jae Ho Lee in Semiconductor Technology

Introduction

Jae Ho Lee is a notable inventor based in Dublin, California, recognized for his contributions to semiconductor technology. He has developed innovative methods that enhance the efficiency of semiconductor manufacturing processes. His work is particularly significant in the field of sidewall image transfer techniques.

Latest Patents

Jae Ho Lee holds a patent for "Systems and methods for performing in-situ deposition of sidewall image transfer spacers." This patent describes a method that involves arranging a substrate within a processing chamber, etching a mandrel layer to create multiple mandrels, and depositing a thin spacer layer on the mandrels and substrate. The process continues with etching to remove the spacer layer from specific areas, leaving it only on the mandrels' sidewalls. This innovative approach streamlines the manufacturing process and improves the quality of semiconductor devices.

Career Highlights

Jae Ho Lee is currently employed at Lam Research Corporation, a leading company in semiconductor manufacturing equipment. His expertise in the field has contributed to advancements in the technology used for producing integrated circuits. His work has been instrumental in enhancing the capabilities of semiconductor fabrication.

Collaborations

Throughout his career, Jae Ho Lee has collaborated with talented professionals, including Changwoo Lee and Phil Friddle. These collaborations have fostered an environment of innovation and have led to significant advancements in semiconductor technology.

Conclusion

Jae Ho Lee's contributions to semiconductor technology through his innovative patent and work at Lam Research Corporation highlight his importance in the field. His advancements in sidewall image transfer processes are paving the way for more efficient semiconductor manufacturing.

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