Gyeonggi-do, South Korea

Jae-Chun Cha


Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2017

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3 patents (USPTO):Explore Patents

Title: Jae-Chun Cha: Innovator in Semiconductor Technology

Introduction

Jae-Chun Cha is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative approaches have paved the way for advancements in semiconductor device fabrication.

Latest Patents

Jae-Chun Cha's latest patents include a method of fabricating a semiconductor device with a tilted preamorphized implant. This method involves preparing a semiconductor substrate with a doping region, performing tilt implantation using a first additional dopant to create an amorphous region, doping a second additional dopant in the amorphous region, forming a metal layer on the doped amorphous region, and finally reacting the doped amorphous region with the metal layer to form metal silicide. Another notable patent is a method of forming regions with hot and cold implants, which includes implanting a first species into a substrate at a cold temperature to create a first region, and implanting a second species into the substrate at a hot temperature to form a second region adjacent to the first.

Career Highlights

Jae-Chun Cha is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work at SK Hynix has allowed him to collaborate with other talented professionals in the field, enhancing the company's innovative capabilities.

Collaborations

Some of Jae-Chun Cha's coworkers include An-Bae Lee and Seung-Woo Jin. Their collaborative efforts contribute to the ongoing advancements in semiconductor technology.

Conclusion

Jae-Chun Cha's contributions to semiconductor technology through his patents and work at SK Hynix Inc. highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor device fabrication.

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