Location History:
- Yongin-si, KR (2020)
- Incheon, KR (2017 - 2023)
Company Filing History:
Years Active: 2017-2023
Title: The Innovative Contributions of Jae-Choon Kim
Introduction
Jae-Choon Kim is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of technology, particularly in the development of advanced packaging solutions for semiconductor devices. With a total of 8 patents to his name, Kim continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is a chip on film package and display device that includes a flexible base film with a first surface and a second surface opposite to each other. This innovative package features a chip mounting region on the first surface, along with a plurality of wirings extending in a first direction toward the chip mounting region. A semiconductor chip is mounted in the chip mounting region and is electrically connected to the wirings. Additionally, the design incorporates a pair of first heat dissipation members on the first surface of the base film, spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction. A second heat dissipation member covers the semiconductor chip and the pair of first heat dissipation members, enhancing the overall efficiency of the device.
Career Highlights
Jae-Choon Kim is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
Throughout his career, Kim has collaborated with notable colleagues, including Seung-Tae Hwang and Kyung-suk Oh. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Jae-Choon Kim's contributions to the field of semiconductor packaging are noteworthy and reflect his commitment to innovation. His patents and collaborations continue to influence the industry, paving the way for future advancements.