Minneapolis, MN, United States of America

Jacob Ray Vavra

This inventor holds 1 USPTO granted patent. Top assignee: Ironwood Electronics, Inc.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jacob Ray Vavra. Retrieved from https://idiyas.com/inventor/jacob-ray-vavra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Jacob Ray Vavra: Innovator in Adapter Technology

Introduction

Jacob Ray Vavra is a notable inventor based in Minneapolis, MN (US). He has made significant contributions to the field of adapter technology, particularly with his innovative designs that enhance device compatibility and functionality. His work exemplifies the spirit of innovation that drives technological advancement.

Latest Patents

Jacob holds a patent for a "Packaged device adapter with force applied using bearing apparatus." This invention features an adapter body that defines a socket cavity designed to receive a packaged device. It also includes a torque applicator that applies an axial force. A bearing structure is strategically positioned between the torque applicator and the packaged device to effectively transfer the force applied by the torque applicator.

Career Highlights

Jacob is currently employed at Ironwood Electronics, Inc., where he continues to develop and refine his innovative ideas. His work at the company has allowed him to focus on creating solutions that address real-world challenges in device connectivity and usability.

Collaborations

Jacob collaborates with talented individuals such as Ilavarasan M Palaniappa and Mickiel P Fedde. These partnerships enhance the creative process and contribute to the development of cutting-edge technologies.

Conclusion

Jacob Ray Vavra is a dedicated inventor whose work in adapter technology has the potential to impact various industries. His innovative spirit and collaborative efforts continue to drive advancements in device compatibility.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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