This inventor holds 1 USPTO granted patent. Top assignee: Raytheon Company. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Jacob Modjeski: Innovator in Electronics Packaging
Introduction
Jacob Modjeski is a notable inventor based in Saint Paul, MN (US). He has made significant contributions to the field of electronics packaging, particularly for moving platforms. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic systems.
Latest Patents
Jacob Modjeski holds a patent for "Electronics packaging for moving platforms." This invention includes a system that features one or more electronics boards and plates designed to interleave the electronics boards in a stack along an axis. The outer surface of the plates forms an outer mold line of a portion of a moving platform. Each plate has an inner diameter and an outer diameter, with the outer surface exhibiting an outer circumference at the outer diameter. This design is crucial for optimizing the integration of electronics in dynamic environments.
Career Highlights
Jacob Modjeski is currently employed at Raytheon Company, where he applies his expertise in electronics and engineering. His work focuses on developing advanced technologies that support various applications in the defense and aerospace sectors. With a strong foundation in engineering principles, he has successfully contributed to projects that require innovative solutions.
Collaborations
Some of Jacob's coworkers include Gary Willenbring and Jason Graham. Their collaborative efforts contribute to the success of projects at Raytheon Company, fostering an environment of innovation and teamwork.
Conclusion
Jacob Modjeski is a distinguished inventor whose work in electronics packaging has made a significant impact in his field. His patent for electronics packaging for moving platforms showcases his innovative spirit and dedication to advancing technology.