Lincoln, NE, United States of America

Jacob Hogberg

This inventor holds 1 USPTO granted patent. Top assignee: The Board of Regents of the University of Nebraska. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jacob Hogberg. Retrieved from https://idiyas.com/inventor/jacob-hogberg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jacob Hogberg and Sensor Emplacement Using Unmanned Aircraft Systems

Introduction

Jacob Hogberg is an inventor associated with Lincoln, Nebraska, and The Board of Regents of the University of Nebraska. His patent work concerns using unmanned aircraft systems to place sensors in soil and assess soil conditions.

Latest Patents

Hogberg is named on 1 patent: “Sensor Emplacement Using Unmanned Aircraft Systems.” The patent describes a UAS equipped with a propulsion system and a sensor emplacement system that includes an auger and one or more motors. After landing at a designated site, the aircraft can drive the auger into the soil and measure augering parameters. An autonomous system trained on soil and augering data then uses those measurements to determine soil classification values.

Career Highlights

The invention combines aerial mobility, mechanical soil sampling, and data-driven soil classification. It outlines a way for an unmanned aircraft to both install a sensor and gather information that can help characterize the soil at the emplacement site.

Collaborations

Hogberg’s listed coworkers include Carrick Detweiler and Brittany Anne Duncan. The patent is associated with The Board of Regents of the University of Nebraska.

Conclusion

Jacob Hogberg’s patent presents an integrated approach to sensor placement and soil assessment, using an unmanned aircraft system to support both tasks.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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