Saint Charles, MO, United States of America

Jack William Henry


Average Co-Inventor Count = 1.5

ph-index = 1


Company Filing History:


Years Active: 2022

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2 patents (USPTO):Explore Patents

Title: Jack William Henry: Innovator in Prepreg Material Technology

Introduction

Jack William Henry is a notable inventor based in Saint Charles, MO (US). He has made significant contributions to the field of prepreg materials, holding 2 patents that showcase his innovative approach to manufacturing and measurement techniques.

Latest Patents

Henry's latest patents include a "Method for measuring overlaps in prepreg materials" and an "Assembly to manufacture a roll of prepreg material." The first patent describes an assembly that connects first and second sheet members using a pressure device that applies pressure while the sheets are in an overlapping arrangement. A sensing system with thin film pressure sensors detects the positions of the leading and trailing edges, while a connection device secures the members together. The second patent outlines an assembly designed to manufacture a roll of prepreg material, featuring a moving system that picks a sheet from a stack and aligns it with the roll's trailing edge. A welding system then connects the sheet to the roll.

Career Highlights

Jack William Henry is currently employed at The Boeing Company, where he applies his expertise in prepreg materials to advance aerospace technology. His work has been instrumental in improving manufacturing processes and ensuring the quality of materials used in various applications.

Collaborations

Henry collaborates with talented individuals such as Daniel A Charles and Aaron Ross Cowin, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Jack William Henry's contributions to the field of prepreg materials through his patents and work at The Boeing Company highlight his role as a key innovator in the industry. His advancements continue to influence manufacturing processes and material quality in aerospace applications.

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