The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jan. 03, 2020
Applicant:
The Boeing Company, Chicago, IL (US);
Inventor:
Jack William Henry, Saint Charles, MO (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B23K 9/02 (2006.01); G01B 11/02 (2006.01); B29C 65/78 (2006.01); B23K 101/18 (2006.01);
U.S. Cl.
CPC ...
B29C 66/1122 (2013.01); B23K 9/02 (2013.01); B29C 65/7832 (2013.01); B29C 66/435 (2013.01); B29C 66/92211 (2013.01); G01B 11/028 (2013.01); B23K 2101/18 (2018.08);
Abstract
An assembly to connect together first and second sheet members. The assembly includes a pressure device that applies pressure to the sheet members while the sheet members are in an overlapping arrangement and positioned on a support platform. A sensing system that includes one or more thin film pressure sensors detects the positions of the leading and trailing edges. A connection device connects the members together in an overlapping arrangement.
Henry, Jack. (2022). Method for measuring overlaps in prepreg materials (U.S. Patent No. 11420399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11420399
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile