Cedar Rapids, IA, United States of America

Jack T Galyean

This inventor holds 1 USPTO granted patent. Top assignee: Moog Gmbh. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jack T Galyean. Retrieved from https://idiyas.com/inventor/jack-t-galyean

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Jack T Galyean: Innovator in High-Frequency Drum-Style Slip-Ring Modules

Introduction

Jack T Galyean is a notable inventor based in Cedar Rapids, Iowa. He has made significant contributions to the field of communication systems through his innovative designs. His work primarily focuses on high-frequency drum-style slip-ring modules, which are essential for contact-type communication systems.

Latest Patents

Jack T Galyean holds a patent for his invention of high-frequency drum-style slip-ring modules. This invention utilizes PCB construction to create a series of stacked electrically-conductive rings and dielectric layers that electrically isolate these rings. Each dielectric layer features a centrally-located aperture, which accommodates a cylindrical ground plane. The design allows for electrical connections to each ring at the module's exterior surface. The slip-ring module is capable of transferring multi-gigabit digital data streams, with bandwidths ranging from DC to 5 GHz or higher.

Career Highlights

Throughout his career, Jack has worked with Moog GmbH, where he has applied his expertise in developing advanced communication technologies. His innovative approach has led to the creation of efficient and high-performance slip-ring modules that enhance data transmission capabilities.

Collaborations

Jack T Galyean collaborates with Donnie S Coleman, a fellow professional in the field. Their partnership has contributed to the advancement of technologies related to slip-ring modules and communication systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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