Neenah, WI, United States of America

Jack M Meyer

This inventor holds 1 USPTO granted patent. Top assignee: Neenah Foundry Company. Active years: 1978.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jack M Meyer. Retrieved from https://idiyas.com/inventor/jack-m-meyer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 1978

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1 patent (USPTO):Explore Patents

Title: Innovations by Jack M Meyer

Introduction

Jack M Meyer is an accomplished inventor based in Neenah, Wisconsin. He has made significant contributions to the field of engineering, particularly in the design of manhole covers. His innovative approach has led to the development of a unique sealing mechanism that addresses common issues faced in urban infrastructure.

Latest Patents

Jack M Meyer holds a patent for a "Sealing manhole cover for use on existing unsealed sanitary sewer." This invention features a manhole cover that has no openings, equipped with a blind pocket for the insertion of a lifting tool. Additionally, it includes a rectangular O-ring groove on the lower surface designed to accommodate a circular O-ring. This design ensures that the O-ring engages the flat bearing surface of a conventional manhole cover frame, providing a complete seal against stormwater.

Career Highlights

Jack M Meyer is associated with Neenah Foundry Company, where he applies his expertise in engineering and innovation. His work has not only improved the functionality of manhole covers but has also contributed to enhanced urban infrastructure safety and efficiency.

Collaborations

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Conclusion

Jack M Meyer exemplifies the spirit of innovation through his patent and contributions to urban infrastructure. His work continues to influence the engineering field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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