Company Filing History:
Years Active: 2003-2004
Title: Jack H Thiesen: Innovator in Micro Cooling Technologies
Introduction
Jack H Thiesen is a notable inventor based in Longmont, CO (US). He has made significant contributions to the field of micro cooling technologies, holding a total of 2 patents. His innovative designs focus on enhancing the efficiency of heat dissipation in electronic devices.
Latest Patents
Thiesen's latest patents include a "Small Scale Chip Cooler Assembly" and "Miniature Reciprocating Heat Pumps and Engines." The Small Scale Chip Cooler Assembly is a microscale cooling system designed for heat dissipating items, such as Intel's Pentium microprocessor. This system features a thermally insulated housing, a thermally conductive evaporator, and a refrigerant that circulates to efficiently manage heat. The Miniature Reciprocating Heat Pumps and Engines patent describes a thermodynamic device that can be constructed using standard micro-fabrication techniques. This device is versatile, capable of providing cooling, generating power, compressing gases, and even operating as a vacuum pump.
Career Highlights
Throughout his career, Thiesen has worked with various companies, including Marconi Communications GmbH and Technology Applications, Inc. His experience in these organizations has contributed to his expertise in developing innovative cooling solutions.
Collaborations
Thiesen has collaborated with notable individuals in the field, including Gary S Willen and Michael R Cosley. These partnerships have likely fostered the exchange of ideas and advancements in technology.
Conclusion
Jack H Thiesen's contributions to micro cooling technologies demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of thermodynamics and practical applications in electronics.