Marconi Communications Gmbh

Technology Applications, Inc.

Jack H Thiesen

Gary S Willen

Michael R Cosley

Richard L Fischer

Robert A Mohling

A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover. The system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.

Small scale chip cooler assembly

The present invention discloses a miniature thermodynamic device that can be constructed using standard micro-fabrication techniques. The device can be used to provide cooling, generate power, compress gases, pump fluids and reduce pressure below ambient (operate as a vacuum pump). Embodiments of the invention relating to the production of a cooling effect and the generation of electrical power, change the thermodynamic state of the system by extracting energy from a pressurized fluid. Energy extraction is attained using an expansion process, which is as nearly isentropic as possible for the appropriately chosen fluid. An isentropic expansion occurs when a compressed gas does work to expand, and in the disclosed embodiments, the gas does work by overcoming either an electrostatic or a magnetic force.

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Longmont, CO, United States of America

Jack H Thiesen