Peoria, AZ, United States of America

J Gordon Davy

This inventor holds 1 USPTO granted patent. Top assignee: Ldf Coatings, LLC.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: J Gordon Davy. Retrieved from https://idiyas.com/inventor/j-gordon-davy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: J Gordon Davy: Innovator in Electroless Plating Technology

Introduction

J Gordon Davy is a notable inventor based in Peoria, AZ (US). He has made significant contributions to the field of electronic assembly through his innovative patent. His work addresses critical issues faced by electronic circuits, particularly those constructed with lead-free tin solders.

Latest Patents

J Gordon Davy holds a patent for "Selective application by electroless plating of a tin-whisker impenetrable metal cap to metals on electronic assemblies." This invention tackles the problem of tin whiskers, which can short out electronic circuits. The patent describes a method of depositing a metal cap on exposed tin-coated surfaces to prevent the growth of these whiskers, ensuring the reliability of electronic circuits.

Career Highlights

Davy is associated with LDF Coatings, LLC, where he applies his expertise in electroless plating technology. His innovative approach has garnered attention in the electronics industry, particularly in the context of lead-free soldering solutions.

Collaborations

Throughout his career, J Gordon Davy has collaborated with notable colleagues, including Robert J Landman and Dennis Fritz. These partnerships have contributed to the advancement of technology in electronic assembly.

Conclusion

J Gordon Davy's contributions to the field of electroless plating and his innovative patent demonstrate his commitment to improving electronic assembly processes. His work continues to influence the industry and enhance the reliability of electronic circuits.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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