Pleasanton, CA, United States of America

Ivan Huang

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):

Title: Ivan Huang - Innovator in Glass Substrate Technology

Introduction

Ivan Huang is a notable inventor based in Pleasanton, CA (US). He has made significant contributions to the field of glass substrate technology, particularly in methods that enhance the durability of thin glass substrates. With a total of 2 patents to his name, Huang's work is paving the way for advancements in this critical area.

Latest Patents

Huang's latest patents focus on a method of forming a 3D crack-stop structure in thin glass substrates. This innovative approach aims to prevent through-substrate cracks from propagating and breaking the substrate and the resulting device. The method includes several steps, such as providing a substrate with one or more dies, forming continuous trenches near the outer edges, and creating a protective layer that wraps around the substrate. These advancements are crucial for improving the reliability and longevity of devices that utilize thin glass substrates.

Career Highlights

Ivan Huang is currently employed at GlobalFoundries Inc., a leading semiconductor manufacturer. His work at the company has allowed him to apply his innovative ideas in a practical setting, contributing to the development of cutting-edge technologies in the semiconductor industry.

Collaborations

Huang has collaborated with talented coworkers, including Elavarasan Pannerselvam and Vijay Sukumaran. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.

Conclusion

Ivan Huang's contributions to the field of glass substrate technology are noteworthy. His innovative patents and collaborative efforts at GlobalFoundries Inc. highlight his commitment to advancing technology in this area. His work is expected to have a lasting impact on the industry.

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