Singapore, Singapore

Iskandar Bin Isehak

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Iskandar Bin Isehak. Retrieved from https://idiyas.com/inventor/iskandar-bin-isehak

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: The Innovations of Iskandar Bin Isehak

Introduction

Iskandar Bin Isehak is a notable inventor based in Singapore, known for his contributions to materials science and engineering. He has made significant strides in the development of composite materials, particularly in the field of polymers.

Latest Patents

Iskandar holds a patent for a device that features a first part made of polyethylene terephthalate (PET) with a fiber fill, bonded to a second part that consists of an alloy of polyester and polycarbonate. This innovative design allows for the two parts to be bonded together by placing them in contact and applying heat, creating a strong and durable composite material.

Career Highlights

Iskandar is currently employed at Hewlett-Packard Development Company, L.P., where he continues to work on advancing technology through innovative materials. His expertise in polymer science has positioned him as a valuable asset in his field.

Collaborations

Throughout his career, Iskandar has collaborated with talented individuals such as Holly F. Junge and Josh Cooper. These partnerships have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Iskandar Bin Isehak's work exemplifies the spirit of innovation in materials science. His contributions, particularly in the realm of composite materials, highlight the importance of collaboration and creativity in driving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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