Company Filing History:
Years Active: 2022-2024
Title: An Insight into Inventor Ishai Zeev Cohen
Introduction
Ishai Zeev Cohen is an innovative inventor based in Haifa, Israel. With a passion for advancing technology, he has made significant contributions to the field of integrated circuits and connectivity monitoring. His work has led to the development of essential patents that enhance the efficiency and performance of multi-IC modules.
Latest Patents
Cohen holds two notable patents, of which his latest is focused on die-to-die connectivity monitoring. This innovative invention features an input/output (I/O) sensor designed specifically for multi-IC modules. The I/O sensor comprises several key components: delay circuitry that receives a data signal from an interconnected part of an IC and generates a delayed data signal; an adjustable delay-line that allows for the input signal to be delayed for a specified duration; and a comparison circuit that generates a comparison signal by assessing the integrity of the data signal against the delayed data signal. The processing logic is tasked with determining the delay time and using the comparison signal to identify a margin measurement, which aids in establishing an interconnect quality parameter.
Career Highlights
Currently, Ishai Cohen is a pivotal member of Proteantecs Ltd., where he applies his expertise in the development of innovative technologies. His focus on improving the performance and reliability of interconnected systems marks him as a key player in the industry. Throughout his career, he has continually sought to push the boundaries of what is possible with integrated circuit technologies.
Collaborations
Cohen works alongside talented colleagues, including Eyal Fayneh and Guy Redler. Together, they collaborate to further the advancements in I/O sensors and IC systems, contributing valuable insights and skills to their projects.
Conclusion
In summary, Ishai Zeev Cohen is an accomplished inventor whose work at Proteantecs Ltd. is marked by innovation and technology advancement. His latest patents reflect his commitment to enhancing connectivity in multi-IC modules, showcasing his vital role in shaping the future of integrated circuits.