Company Filing History:
Years Active: 2020
Title: Innovations by Isaac Varela in 3D Printed Substrates
Introduction
Isaac Varela is an accomplished inventor based in El Paso, TX (US). He has made significant contributions to the field of additive manufacturing, particularly in the area of three-dimensional electronic and electromechanical apparatuses. His innovative approach to connecting metal foils and wires in 3D printed substrates has garnered attention in the research community.
Latest Patents
Isaac Varela holds a patent for a method of connecting metal foils and wires at different layers in 3D printed substrates. The patent describes a three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and the method of configuring such an apparatus. In an example embodiment, the apparatus includes a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. This structure features internal cavities created by an extrusion-based additive manufacturing system, enhanced with various secondary embedding processes. The design allows for structural integrated metal objects to span the internal cavities, improving the electromagnetic properties of the apparatus.
Career Highlights
Isaac Varela is affiliated with the University of Texas System, where he continues to advance his research and development in innovative manufacturing techniques. His work has implications for various applications, including electronics and thermal management systems.
Collaborations
Isaac has collaborated with notable colleagues such as Eric MacDonald and David Espalin, contributing to the advancement of technology in their respective fields.
Conclusion
Isaac Varela's innovative work in 3D printed substrates exemplifies the potential of additive manufacturing in creating advanced electronic and electromechanical systems. His contributions are paving the way for future developments in this exciting field.