The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Feb. 07, 2017
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Eric MacDonald, El Paso, TX (US);

David Espalin, El Paso, TX (US);

Isaac Varela, El Paso, TX (US);

Ryan Wicker, El Paso, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/68 (2006.01); B29C 70/70 (2006.01); B29C 64/118 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/106 (2017.01); B29C 70/88 (2006.01); B29C 69/00 (2006.01); B33Y 80/00 (2015.01); B33Y 30/00 (2015.01); B29K 101/12 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/106 (2017.08); B29C 69/001 (2013.01); B29C 70/882 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B29C 2035/0838 (2013.01); B29K 2101/12 (2013.01); B29K 2705/00 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3493 (2013.01); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.


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