This inventor holds 4 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1994-1998.
Company Filing History:
Years Active: 1994-1998
Title: Innovations of Isaac T Poku
Introduction
Isaac T Poku is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of technology, particularly in methods related to substrate analysis. With a total of 4 patents to his name, Poku's work reflects a commitment to advancing manufacturing processes and improving product quality.
Latest Patents
One of his latest patents is a non-destructive method of determining substrate tilt within a packaged component. This innovative approach involves using acoustic waves to measure distances between the component surface and various regions on the substrate surface. By comparing these measurements to a threshold value, the method ensures accurate assessments without damaging the component.
Another significant patent is a method for determining the cleanliness of a surface of a substrate. This method utilizes a visual pattern to analyze the spread area of a liquid droplet on the substrate surface. By comparing the droplet's area to the visual pattern, operators can easily determine if the surface is sufficiently clean, thereby enhancing manufacturing throughput.
Career Highlights
Isaac T Poku is currently employed at Motorola Corporation, where he continues to innovate and develop new technologies. His work at Motorola has allowed him to apply his inventive skills in a practical setting, contributing to the company's reputation for quality and innovation.
Collaborations
Poku has collaborated with several talented individuals, including Robert Yarosh and Rama P Cherkur. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Isaac T Poku's contributions to the field of technology through his patents and work at Motorola Corporation highlight his role as an influential inventor. His innovative methods for analyzing substrate tilt and cleanliness are paving the way for advancements in manufacturing processes.