Alexandria, MN, United States of America

Irvan Leo Pazdernick

This inventor holds 1 USPTO granted patent. Top assignee: Douglas Machine Inc.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Irvan Leo Pazdernick. Retrieved from https://idiyas.com/inventor/irvan-leo-pazdernick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 47(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Irvan Leo Pazdernick: Innovator in Packaging Technology

Introduction

Irvan Leo Pazdernick is a notable inventor based in Alexandria, MN (US). He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique method for packaging articles, which has garnered attention in the industry.

Latest Patents

Irvan holds a patent for a "Method for packaging articles using pre-perforated heat shrink film." This method involves enclosing articles in heat-shrink film and includes a process for perforating or slitting the heat shrink film. His invention is designed to enhance the efficiency and effectiveness of packaging processes.

Career Highlights

Irvan is currently employed at Douglas Machine Inc., where he applies his expertise in packaging technology. His work at the company has allowed him to further develop his skills and contribute to innovative solutions in the packaging sector.

Collaborations

Irvan has collaborated with talented individuals such as Daniel Leonard Floding and Richard Jerome Schoeneck. These partnerships have fostered a creative environment that encourages the development of new ideas and technologies.

Conclusion

Irvan Leo Pazdernick is a dedicated inventor whose work in packaging technology has made a significant impact. His innovative methods and collaborations continue to shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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