Simpang Ampat, Malaysia

Ing Chyuan Ooi

This inventor holds 1 USPTO granted patent. Top assignee: Western Digital Technologies, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ing Chyuan Ooi. Retrieved from https://idiyas.com/inventor/ing-chyuan-ooi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Ing Chyuan Ooi: Innovator in Thermal Relief Technology

Introduction

Ing Chyuan Ooi is a notable inventor based in Simpang Ampat, Malaysia. With a focus on enhancing electronic circuit designs, he has contributed significantly to the field of printed circuit boards (PCBs). His innovative approach has led to the development of a unique patent that addresses thermal management in electronic components.

Latest Patents

Ooi holds one patent titled "Thermal relief for through-hole and surface mounting." This invention introduces a multi-layer printed circuit board that incorporates a bonding surface on its first surface, complete with a thermal relief pad. This design effectively manages heat in electronic components. The patent features a first conductive plane, which partially surrounds the thermal relief pad and is connected to the bonding surface via several spokes. Additionally, a second thermal relief pad and conductive plane further optimize the PCB design. A critical aspect of this invention is a through-hole included in the bonding surface, designed to receive electrical connectors of electronic components, enhancing overall functionality.

Career Highlights

Ing Chyuan Ooi is employed at Western Digital Technologies, Inc., a leading company in data storage solutions. His work at the company reflects a commitment to innovation in electronic technologies. Ooi's contributions help ensure high-quality performance in the ever-evolving electronics landscape.

Collaborations

Throughout his career, Ooi has had the pleasure of collaborating with talented individuals such as Chun Sean Lau and Choon Kuai Lee. These partnerships reflect the spirit of teamwork and innovation that drives progress in technology and product development.

Conclusion

Ing Chyuan Ooi stands out as a visionary inventor in the area of thermal management for printed circuit boards. His patent serves as a testament to his dedication to improving electronic designs while working at a prominent technology company. Ooi's innovative spirit and collaborative efforts underscore the importance of creativity in advancing the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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