Zurich, Switzerland

Ilias Bosdas

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Ams Sensors Asia Pte. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ilias Bosdas. Retrieved from https://idiyas.com/inventor/ilias-bosdas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ilias Bosdas and His Optoelectronic Module Patent.

Introduction

Ilias Bosdas is an inventor associated with Zurich, Switzerland, and Ams Sensors Asia Pte. Ltd. His patent work includes an invention concerning the electrical connection and support of optical assemblies in optoelectronic devices.

Latest Patents

Bosdas is credited with 1 patent: “Optoelectronic module.” The patent describes a support structure that holds an optical assembly above an optoelectronic device. Its electrically conductive lead has one interface portion near the support surface to contact the optical assembly’s conductive structure and another interface portion on the opposite side. The lead extends between these portions to maintain electrical contact with the supported assembly.

Career Highlights

The available information identifies Bosdas as an inventor associated with Ams Sensors Asia Pte. Ltd. His patent reflects work on integrating mechanical support and electrical connectivity in optoelectronic modules.

Collaborations

Hartmut Rudmann and Ian Kilburn are listed as Bosdas’s coworkers. The provided information does not specify whether they collaborated with him on this patent.

Conclusion

Ilias Bosdas’s recorded patent focuses on a support structure that combines optical assembly mounting with a conductive path, highlighting a practical approach to optoelectronic module design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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