Ilhyoung Lee

Title: Ilhyoung Lee: Innovator in Substrate Bonding Technology

Introduction

Ilhyoung Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of substrate bonding processes.

Latest Patents

Ilhyoung Lee holds a patent for a substrate bonding apparatus. This apparatus is designed to bond a first substrate to a second substrate effectively. It includes a first bonding chuck with a deformable plate that supports the first substrate and a pneumatic adjustor that regulates the pressure to deform the plate. Similarly, the second bonding chuck features a second deformable plate and pneumatic adjustor for the second substrate. This innovative design allows for precise control over the bonding process, improving overall efficiency.

Career Highlights

Ilhyoung Lee is currently employed at Samsung Electronics Co., Ltd. His work at this leading technology company has allowed him to focus on advancing substrate bonding techniques. His expertise in this area has positioned him as a valuable asset to his team and the company.

Collaborations

Ilhyoung Lee collaborates with talented coworkers, including Ilyoung Han and Taeyeong Kim. Their combined efforts contribute to the innovative projects at Samsung Electronics, fostering a collaborative environment that encourages creativity and technological advancement.

Conclusion

Ilhyoung Lee's contributions to substrate bonding technology exemplify the spirit of innovation. His patent and work at Samsung Electronics highlight his commitment to advancing technology in this field. His achievements serve as an inspiration for future inventors and innovators.