Il-Ki Kim

Title: Il-Ki Kim: Innovator in Ball Grid Array Packaging

Introduction

Il-Ki Kim is a notable inventor based in Namyangju, South Korea. He has made significant contributions to the field of packaging technology, particularly in the development of ball grid array (BGA) packages. With a total of 2 patents, his work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

One of Il-Ki Kim's latest patents is a "Package with barrier wall and method for manufacturing the same." This innovative BGA package is designed to suppress flash contamination. It features a flash contamination barrier wall, which is a portion of a copper pattern provided on a substrate. During the molding process, this barrier wall prevents flash from contaminating a ball land. The design restricts the flash to flow through a concave portion defined by the surface of the substrate, ensuring the integrity of the package.

Career Highlights

Il-Ki Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals, including his coworker Min-Keun Kwak. Together, they contribute to advancements in packaging technology that are crucial for modern electronic devices.

Collaborations

Due to space constraints, the details of collaborations will not be included.

Conclusion

Il-Ki Kim's innovative work in the field of ball grid array packaging demonstrates his commitment to improving electronic component reliability. His patents reflect a deep understanding of the challenges in packaging technology and offer solutions that benefit the industry.