Location History:
- Champaign, IL (US) (2013)
- Aloha, OR (US) (2015)
Company Filing History:
Years Active: 2013-2015
Title: Innovations by Inventor Ik Su Chun
Introduction
Ik Su Chun, an innovative inventor based in Aloha, Oregon, has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, Chun continues to advance methods for enhancing the capabilities of nanoscale materials.
Latest Patents
Chun's latest patents showcase groundbreaking methods for forming intricate nanostructures. His first patent, titled "Method of forming an array of high aspect ratio semiconductor nanostructures," details a novel approach involving the use of a solid electrolyte stamp to create metal ion fluxes. This method results in a conductive pattern on a semiconductor substrate, allowing for features with a length-to-width aspect ratio of at least about 5:1.
The second patent, "Method of forming nanoscale three-dimensional patterns in a porous material," outlines a technique for creating nanoscale patterns in a porous semiconductor. By removing semiconductor material beneath a nanoscale metal pattern, the method enables the formation of trenches with a depth-to-width aspect ratio of at least about 10:1. This innovation also includes the potential to create self-integrated porous low-k dielectric insulators and supports wafer-level chip scale packaging integration.
Career Highlights
Chun's career is marked by his dedication to advancing semiconductor technology. His pioneering work not only demonstrates his inventive prowess but also emphasizes the application of his patents in practical settings.
Collaborations
Throughout his career, Chun has collaborated with esteemed colleagues, including Xiuling Li and David N Ruzic. These partnerships have further amplified the impact of his research, combining diverse expertise to push the boundaries of semiconductor innovations.
Conclusion
Ik Su Chun's contributions to the field of semiconductor technology through his patents highlight the importance of innovation in creating advanced materials. As he continues his work at the University of Illinois, the implications of his research are likely to resonate in the industry, paving the way for future advancements.