Austin, TX, United States of America

Ian Y K Yee

This inventor holds 1 USPTO granted patent. Top assignee: Teravicta Technologies, Inc.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ian Y K Yee. Retrieved from https://idiyas.com/inventor/ian-y-k-yee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Ian Y K Yee: Innovator in Micromechanical Devices

Introduction

Ian Y K Yee is a notable inventor based in Austin, Texas. He has made significant contributions to the field of micromechanical devices, showcasing his innovative spirit and technical expertise. His work focuses on enhancing the functionality and efficiency of these devices through unique methodologies.

Latest Patents

Ian Y K Yee holds a patent for a "Gradually-actuating micromechanical device." This invention involves a method for forming a micromechanical device where the force associated with the operation of the device is varied across a conductive element. The method can be applied to create a switch that adapts the force required for actuation, including closing, applied, restoring, and sticking forces. This innovation allows for a variable-valued circuit element that enhances the performance of micromechanical devices.

Career Highlights

Ian Y K Yee is currently associated with Teravicta Technologies, Inc., where he continues to develop and refine his inventions. His work at the company emphasizes the importance of innovation in technology and the practical applications of his patented methods.

Collaborations

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Conclusion

Ian Y K Yee's contributions to micromechanical devices exemplify the impact of innovative thinking in technology. His patent reflects a deep understanding of the complexities involved in device operation and showcases his commitment to advancing the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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