Plymouth, United Kingdom

Ian Murray

This inventor holds 3 USPTO granted patents and 2 EPO patents. Top assignee: Plessey Semiconductors Limited. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ian Murray. Retrieved from https://idiyas.com/inventor/ian-murray-h2msuof4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

 

Average Co-Inventor Count = 5.5

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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3 patents (USPTO):Explore Patents

Title: Ian Murray - Innovator in Substrate Bonding Technology

Introduction

Ian Murray is a notable inventor based in Plymouth, GB. He has made significant contributions to the field of substrate bonding, showcasing his innovative approach through his patented technology. His work is particularly relevant in the semiconductor industry, where precision and reliability are paramount.

Latest Patents

Ian Murray holds a patent for a method of preparing a substrate for substrate bonding. This patent outlines a process that involves forming a recess in the substrate surface and applying a bondable dielectric layer. The dielectric layer is designed to create a dielectric cavity, which is essential for making electrical contact through a plug that extends beyond the bonding surface. This innovative method enhances the efficiency and effectiveness of substrate bonding in various applications.

Career Highlights

Ian is currently employed at Plessey Semiconductors Limited, where he continues to develop and refine his innovative ideas. His work at Plessey has positioned him as a key player in advancing semiconductor technologies. With a focus on practical applications, Ian's contributions are helping to shape the future of the industry.

Collaborations

Ian has collaborated with talented individuals such as Kevin Stribley and Reetta Griffiths. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ian Murray's work in substrate bonding technology exemplifies the spirit of innovation in the semiconductor industry. His patent and ongoing contributions reflect a commitment to advancing technology and improving processes. Ian's efforts are paving the way for future advancements in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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