I Zeng Lee

Title: I Zeng Lee: Innovator in Semiconductor Packaging

Introduction

I Zeng Lee is a notable inventor based in Kaohsiung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs that enhance performance and reliability.

Latest Patents

I Zeng Lee holds a patent for a "Ball grid array semiconductor package with improved strength and electric performance and method for making the same." This invention discloses metal reinforced layers positioned at the upper and lower surfaces of a thin substrate to enhance its strength. The reinforced substrate is less prone to deformation due to temperature fluctuations during the packaging process, significantly reducing warpage in semiconductor packages. Additionally, the metal reinforced layer at the lower surface serves as a ground plane for the ball grid array (BGA) semiconductor package, improving grounding effects. This design optimizes the return current path and impedance matching control, while also minimizing noise and crosstalk among signal lines in high-frequency applications.

Career Highlights

I Zeng Lee is associated with Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making it more robust and efficient.

Collaborations

I Zeng Lee has collaborated with notable colleagues such as Chun Hung Lin and Su Tao, contributing to various projects that enhance semiconductor technology.

Conclusion

I Zeng Lee's innovative work in semiconductor packaging exemplifies the importance of engineering advancements in technology. His contributions continue to influence the industry, ensuring better performance and reliability in electronic devices.