I Made Wahyu Diyatmika

Title: I Made Wahyu Diyatmika: Advancing Tin Whisker Mitigation

Introduction

I Made Wahyu Diyatmika is an inventor associated with the National Taiwan University of Science and Technology in Taipei, Taiwan. His patent work addresses tin whisker growth, a materials challenge relevant to the reliability of tin-coated components.

Latest Patents

Diyatmika is associated with 1 patent: “Tin Whisker Mitigation Material Using Thin Film Metallic Glass Underlayer.” The invention places a thin film metallic glass (TFMG) layer between a metal substrate, such as copper, and a tin layer. It describes ZrTiNi or ZrCuAlNi as possible underlayer materials, intended to limit interactions at the copper-tin interface and inhibit tin whisker growth. The patent presents experimental data supporting the use of these TFMG underlayers as a lower-cost alternative to a conventionally used thick tin layer.

Career Highlights

The patent reflects Diyatmika’s work on applying thin film metallic glass to address an engineering problem in metal coatings. Its proposed approach focuses on controlling interface interactions to reduce whisker formation.

Collaborations

The supplied information lists Jinn P. Chu and Yee-Wen Yen as Diyatmika’s coworkers. Their names are associated with his professional context at the National Taiwan University of Science and Technology.

Conclusion

I Made Wahyu Diyatmika’s patent proposes TFMG underlayers as a practical way to inhibit tin whisker growth and improve the reliability of tin-coated materials.