I-Kuo Lin

Title: I-Kuo Lin: Innovator in Integrated Circuit Packaging

Introduction

I-Kuo Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on developing techniques that enhance the efficiency and effectiveness of electronic devices.

Latest Patents

I-Kuo Lin's latest patents revolve around the concept of extremely thin package structures. These patents disclose innovative techniques for achieving such structures. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections. The Epoxy Molding Compound (EMC) surrounds the integrated circuit, except at the backside and connecting areas, where the integrated circuit connects to the leadframe or substrate. This advancement is crucial for the miniaturization of electronic devices.

Career Highlights

I-Kuo Lin is currently associated with Silego Technology Inc., where he continues to push the boundaries of integrated circuit technology. His expertise in packaging solutions has positioned him as a key player in the industry.

Collaborations

I-Kuo Lin has collaborated with notable colleagues, including Chia Chuan Chen and Lung-Pao Chin. These partnerships have fostered innovation and contributed to the development of advanced packaging techniques.

Conclusion

I-Kuo Lin's contributions to integrated circuit packaging demonstrate his commitment to innovation in the electronics field. His patents reflect a deep understanding of technology and its applications in modern devices.