I Han Wu

Title: Innovations of I Han Wu in Semiconductor Packaging Technology

Introduction

I Han Wu is a notable inventor based in Dali, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the packaging of light-emitting elements. With a total of four patents to his name, his work has garnered attention for its innovative approaches and practical applications.

Latest Patents

One of I Han Wu's latest patents is a packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity. This device features a metal base made of highly heat conductive materials such as copper or aluminum. It includes a first electrode area and at least one second electrode area that are electrically isolated. The array chip is placed on the first electrode area, housing multiple matrix-arranged semiconductor light-emitting elements along with a wire bond pad. The light-emitting elements can be VCSEL, HCSEL, or RCLED types. Metal wires connect the wire bond pad to the second electrode area to transmit power signals. A conductive adhesive is used between the bottom surface and the first electrode area to ensure a strong electrical connection.

Career Highlights

I Han Wu is currently employed at Truelight Corporation, where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in advancing technologies that enhance the performance and efficiency of light-emitting devices.

Collaborations

I Han Wu collaborates with talented coworkers such as Jin Shan Pan and Cheng Ju Wu. Their combined expertise contributes to the innovative projects at Truelight Corporation.

Conclusion

I Han Wu's contributions to semiconductor packaging technology reflect his dedication to innovation and excellence. His patents demonstrate a commitment to advancing the field and improving the functionality of light-emitting elements.