Hyunsuk Yang

Title: Hyunsuk Yang: Innovator in Semiconductor Technology

Introduction

Hyunsuk Yang is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative semiconductor packaging solutions that enhance performance and efficiency.

Latest Patents

One of Hyunsuk Yang's latest patents involves a semiconductor package and a method of manufacturing the semiconductor package. This invention includes a core substrate and a semiconductor chip with chip pads. The design features a redistribution wiring layer that covers the lower surface of the core substrate, which includes redistribution wirings electrically connected to the chip pads. Additionally, it incorporates a pair of capacitor pads that are exposed from the outer surface of the redistribution wiring layer. Conductive pastes are applied on the capacitor pads, along with a capacitor via the conductive pastes, which has first and second outer electrodes on the capacitor pads. Each capacitor pad includes a pad pattern exposed from the outer surface of the redistribution wiring layer, and at least one via pattern at a lower portion of the pad pattern, electrically connected to at least one of the redistribution wirings. Notably, the via pattern is eccentric by a distance from the center line of the pad pattern.

Career Highlights

Hyunsuk Yang has worked with leading companies in the technology sector, including Samsung Electronics Co., Ltd. and Samsung Display Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor packaging.

Collaborations

Throughout his career, Hyunsuk Yang has collaborated with talented individuals such as Jaeyoon Jung and Kwangchul Jung. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Hyunsuk Yang is a notable inventor whose work in semiconductor technology has led to several important patents. His innovative designs and collaborations with industry leaders continue to shape the future of semiconductor packaging.