Suwon-si, South Korea

Hyunsub Park

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyunsub Park. Retrieved from https://idiyas.com/inventor/hyunsub-park-8yed48o9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hyunsub Park and Wireless Charging Innovation

Introduction

Hyunsub Park is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics. His patent work includes an electronic device designed to support wireless charging as the device’s physical configuration changes.

Latest Patents

Park is named on 1 patent: “Electronic Device Comprising Wireless Charging Circuit.” The invention describes a device with a housing made up of two portions, one of which can change position relative to the other. A processor controls the wireless charging circuit to receive power through magnetic fields with different centers, depending on the portions’ positional relationship. This approach is intended to accommodate wireless charging across different device configurations.

Career Highlights

Park’s listed patent reflects work on wireless charging circuitry and adaptable electronic-device designs. His association with Samsung Electronics connects this invention to the company’s broader development of consumer electronics.

Collaborations

Jaeyoung Huh and Sungchul Park are identified as Park’s coworkers. Their names are provided as professional associations, though the available information does not specify their roles in this patent.

Conclusion

Hyunsub Park’s patent focuses on maintaining wireless power reception as an electronic device changes configuration, highlighting an engineering approach to adaptable charging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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